Board Fabrication

SlingShot Assembly offers customized solutions for board fabrication needs. Instead of wondering if you’re getting the best price or the best quality from a single board shop, talk with our board experts.

We work with a small group of highly qualified U.S. board fabrication companies that can meet the requirements of most any design. From simple 2-layer boards to complex HDI (High Density Interconnect) designs, we provide quality bare boards at competitive prices and lead times.

If you’re looking for assembly with board fabrication, contact us or try our online quoting and order system right now.

Board Fabrication Capabilities:

Standard Board Fabrication Capabilities
  • Layers: 2-6
  • Board Thickness: 1.57mm/0.062in
  • Trace Width: 5mil minimum
  • Trace Spacing: 5mil minimum
  • Material: FR4 Tg-170/Tg-180
  • Minimum Finished Hole Size Plated: 8 mil minimum
  • Inner Copper Weight Starting: all ½oz or all 1oz
  • Outer Copper Weight Starting: 1oz to 2oz
  • Finish: Leaded/Lead Free HASL, ENIG
  • Soldermask Color: Green, Black, White, Blue, Red
  • Inspection: IPC Class 2-A600
  • Electrical Test: Yes
Advanced Board Fabrication Capabilities (Partial List)
  • Layers: 8-plus
  • Material: FR4, Rogers, Duroid, Isola 410
  • Inspection: IPC Class 6012 Class 2, 3 and 3a
  • Inner Copper Weight Starting: ½oz to 4 oz
  • External Copper Weight Starting: 1oz to 8oz
  • Minimum Finished Hole Size Plated: 0.004in (depending on panel thickness)
  • Laser Drilled Microvia: 0.003in
  • Buried/Blind Vias
  • Filled Vias: Conductive and Non-conductive
  • Board Thickness: 0.010in to 0.250in
  • Finish: Immersion Silver, ENEPIG, Immersion Tin, Others